A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component. - Sanguk Lee; Hyunwoong Kim; Jangyong Ahn; Jaewon Rhee; Jaeyong Cho; Hongseok Kim; Seungyoung Ahn (IEEE Trans. Instrum. Meas., 2024)