Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study. - Hai Ding; I. Charles Ume; Jian Zhang; Daniel F. Baldwin (IEEE Trans. Instrum. Meas., 2005)

Revolutionalising engineering programmes in developing countries by incorporating a mechatronics curriculum. - Udochukwu B. Akuru; Alexander O. E. Animalu; O. V. Ekechukwu; I. Charles Ume; Ogbonnaya I. Okoro; Edward Chikuni (AFRICON, 2011)