Study on Dynamic Void Evolution During Transfer Molding Process of Flip Chip Package. - Ian Hu; Tzu-Chun Hung; Mu-Heng Zhou (IAS, 2025)

Void Formation Analysis in the Molded Underfill Process for Flip-Chip Packaging. - Ian Hu; Tzu-Chun Hung; Mu-Heng Zhou; Heng-Sheng Lin; Dao-Long Chen (Comput. Mater. Continua, 2025)