Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages. - Kenny Mahan; Byung Kim; Bulong Wu; Bongtae Han; Ilho Kim; Hojeong Moon; Young Nam Hwang (Microelectron. Reliab., 2016)

Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method. - Hsiu-Ping Wei; Bongtae Han; Byeng Dong Youn; Hyuk Shin; Ilho Kim; Hojeong Moon (Microelectron. Reliab., 2017)

Learning Flexible Body Collision Dynamics with Hierarchical Contact Mesh Transformer. - Youn-Yeol Yu; Jeongwhan Choi 002; Woojin Cho; Kookjin Lee; Nayong Kim; Kiseok Chang; ChangSeung Woo; Ilho Kim; SeokWoo Lee; Joon-Young Yang; Sooyoung Yoon; Noseong Park (ICLR, 2024)