Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC. - Imed Jani; Didier Lattard; Pascal Vivet; Edith Beigné (NEWCAS, 2017)

BISTs for post-bond test and electrical analysis of high density 3D interconnect defects. - Imed Jani; Didier Lattard; Pascal Vivet; Lucile Arnaud; Edith Beigné (ETS, 2018)

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. - Lucile Arnaud; Stéphane Moreau; Amadine Jouve; Imed Jani; Didier Lattard; F. Fournel; C. Euvrard; Y. Exbrayat; Viorel Balan; Nicolas Bresson; S. Lhostis; J. Jourdon; et al. (IRPS, 2018)

Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects. - Imed Jani; Didier Lattard; Pascal Vivet; Lucile Arnaud; Edith Beigné (3DIC, 2019)

Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning. - Imed Jani; Didier Lattard; Pascal Vivet; Jean Durupt; Sébastien Thuries; Edith Beigné (ETS, 2019)