CPI reliability and EMI benefit for MIM CAP embedded C4 package. - Hyunsuk Chun; In Hak Baick; Sangsu Ha; Eunmi Kwon; Seungbae Lee; Seil Kim; Sangwoo Pae; Jongwoo Park 001 (IRPS, 2015)

Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR). - Seongwon Jeong; Jinseok Kim 005; Ayoung Kim; Byungwook Kim; Moonsoo Lee; Jaewon Chang; In Hak Baick; Hanbyul Kang; Younggeun Ji; Sangchul Shin; Sangwoo Pae (IRPS, 2018)