Die to wafer 3D stacking for below 10um pitch microbumps. - Jaber Derakhshandeh; Lin Hou; Inge De Preter; Carine Gerets; Samuel Suhard; Vikas Dubey; Geraldine Jamieson; Fumihiro Inoue; Tomas Webers; Pieter Bex; Giovanni Capuz; Eric Beyne; et al. (3DIC, 2016)