Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. - Gweltaz Gaudin; Gregory Riou; Didier Landru; Catherine Tempesta; Ionut Radu; Mariam Sadaka; Kevin Winstel; Emily Kinser; Robert Hannon (3DIC, 2010)

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. - Ionut Radu; Didier Landru; Gweltaz Gaudin; Gregory Riou; Catherine Tempesta; Fabrice Letertre; Léa Di Cioccio; Pierric Gueguen; Thomas Signamarcheix; C. Euvrard; Jérôme Dechamp; Laurent Clavelier; et al. (3DIC, 2010)

Pre bonding metrology solutions for 3D integration. - Gregory Riou; Gweltaz Gaudin; Didier Landru; Catherine Tempesta; Ionut Radu; Mariam Sadaka; Kevin Winstel; Emily Kinser; Robert Hannon; Boris V. Kamenev; Michael Darwin; Robert Sachs (3DIC, 2010)

Novel low temperature 3D wafer stacking technology for high density device integration. - Ionut Radu; Gweltaz Gaudin; William van den Daele; Fabrice Letertre; Carlos Mazure; Léa Di Cioccio; Thomas Lacave; Frederic Mazen; Pascal Scheiblin; Thomas Signamarcheix; Sorin Cristoloveanu (ESSDERC, 2013)

Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration. - Mariam Sadaka; Ionut Radu; Chrystelle Lagahe-Blanchard; Léa Di Cioccio (ICICDT, 2013)

3D monolithic integration: Stacking technology and applications. - Ionut Radu; Bich-Yen Nguyen; Gweltaz Gaudin; Carlos Mazure (ICICDT, 2015)

Multi-Gate FD-SOI Single Electron Transistor for hybrid SET-MOSFET quantum computing. - Fabio Bersano; Franco De Palma; Fabian Oppliger; Floris Braakman; Ionut Radu; Pasquale Scarlino; Martino Poggio; Adrian Mihai Ionescu (ESSCIRC, 2022)