Temperature controlled oven for low noise measurement systems [for electromigration characterization]. - Carmine Ciofi; Ivan Ciofi; Stefano C. Di Pascoli; Bruno Neri (IEEE Trans. Instrum. Meas., 2000)

Metodi e strumentazione per la caratterizzazione di interconnessioni VLSI. - Ivan Ciofi (2001)

Methodology for extracting the characteristic capacitances of a power MOSFET transistor, using conventional on-wafer testing techniques. - Christoph Kerner; Ivan Ciofi; Thomas Chiarella; Stefaan Van Huylenbroeck (ESSDERC, 2012)

Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies. - Trong Huynh Bao; Dmitry Yakimets; Julien Ryckaert; Ivan Ciofi; Rogier Baert; Anabela Veloso; Jürgen Bömmels; Nadine Collaert; Philippe Roussel; S. Demuynck; Praveen Raghavan; Abdelkarim Mercha; et al. (ESSDERC, 2014)

Impact of process variability on BEOL TDDB lifetime model assessment. - Kris Croes; Deniz Kocaay; Ivan Ciofi; Jürgen Bömmels; Zsolt Tökei (IRPS, 2015)

Intrinsic reliability of local interconnects for N7 and beyond. - Kris Croes; Alicja Lesniewska; Chen Wu; Ivan Ciofi; Agnieszka Banczerowska; B. Briggs; S. Demuynck; Zsolt Tökei; Jürgen Bömmels; Yves Saad; W. Gao (IRPS, 2015)

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. - Houman Zahedmanesh; Mario Gonzalez; Ivan Ciofi; Kristof Croes; Jürgen Bömmels; Zsolt Tökei (Microelectron. Reliab., 2016)

LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration. - Deniz Kocaay; Philippe Roussel; Kris Croes; Ivan Ciofi; Yves Saad; Ingrid De Wolf (Microelectron. Reliab., 2017)

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing. - Deniz Kocaay; Philippe Roussel; Kristof Croes; Ivan Ciofi; Alicja Lesniewska; Ingrid De Wolf (IRPS, 2018)

Insights into metal drift induced failure in MOL and BEOL. - Chen Wu; O. Varela Pedreira; Alicja Lesniewska; Yunlong Li; Ivan Ciofi; Zsolt Tökei; Kris Croes (IRPS, 2018)

A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network. - Houman Zahedmanesh; Ivan Ciofi; Odysseas Zografos; Mustafa Badaroglu; Kristof Croes (SLIP, 2021)

Assessment of critical Co electromigration parameters. - O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; Philippe J. Roussel; Marleen H. van der Veen; Veerle Simons; Emmanuel Chery; Ivan Ciofi; Kris Croes (IRPS, 2022)

System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents. - Houman Zahedmanesh; Ivan Ciofi; Odysseas Zografos; Kristof Croes; Mustafa Badaroglu (IRPS, 2022)

Towards accurate temperature prediction in BEOL for reliability assessment (Invited). - Melina Lofrano; Herman Oprins; Xinyue Chang; Bjorn Vermeersch; Olalla Varela Pedreira; Alicja Lesniewska; Vladimir Cherman; Ivan Ciofi; Kristof Croes; Seongho Park; Zsolt Tokei (IRPS, 2023)

A pragmatic network-aware paradigm for system-level electromigration predictions at scale. - Houman Zahedmanesh; Philippe Roussel; Ivan Ciofi; Kristof Croes (IRPS, 2023)

Challenges for Interconnect Reliability: From Element to System Level. - Olalla Varela Pedreira; Houman Zahedmanesh; Youqi Ding; Ivan Ciofi; Kristof Croes (ISPD, 2023)

Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node. - Giuliano Sisto; R. Preston; Rongmei Chen; Gioele Mirabelli; Anita Farokhnejad; Yun Zhou; Ivan Ciofi; Anne Jourdain; A. Veloso; Michele Stucchi; Odysseas Zografos; Pieter Weckx; et al. (VLSI Technology and Circuits, 2023)

BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure. - Y. Fang; Alicja Lesniewska; Ivan Ciofi; Philippe Roussel; Chen Wu; Victor Vega-Gonzalez; Ingrid De Wolf; Kris Croes (IRPS, 2024)

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. - O. Varela Pedreira; Youqi Ding; D. Coenen; Philippe Roussel; Ahmed Sobhi Saleh; Veerle Simons; Houman Zahedmanesh; Ivan Ciofi; Kris Croes (IRPS, 2024)

Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND. - Davide Tierno; Antonio Arreghini; Alicja Lesniewska; Y. Jeong; Marleen H. van der Veen; J. Stiers; N. Bazzazian; Ivan Ciofi; Geert Van den Bosch; Maarten Rosmeulen (IRPS, 2024)

Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects. - Anshul Gupta; Shreya Kundu; Stefan Decoster; K. Sah; G. Delie; B. Truijen; Davide Tierno; Giulio Marti; O. Varela Pedreira; B. Kenens; Y. Hermans; C. Adelmann; et al. (VLSI Technology and Circuits, 2024)

Local Electric Field-Aware 3D TDDB Model for BEOL Reliability Predictions. - Y. Fang; Alicja Lesniewska; Ivan Ciofi; Philippe Roussel; I. De Wolf; Kris Croes (IRPS, 2025)

Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps. - Alicja Lesniewska; Y. Fang; G. Delie; Philippe Roussel; Koen Van Sever; Emmanuel Chery; O. Varela Pedreira; Ivan Ciofi; S. H. Park; Zsolt Tokei; Kris Croes (IRPS, 2025)