First Radio-Frequency Circuits Fabricated in Top-Tier of a Full 3D Sequential Integration Process at mmW for 5G Applications. - J. Luge-Alvarez; J. B. David; Alexandre Siligaris; Vincent Puyal; G. Moritz; Tadeu Mota Frutuoso; V. Lapras; Claire Fenouillet-Béranger; Laurent Brunet; P. Vincent; Didier Lattard; Xavier Garros; et al. (VLSI Technology and Circuits, 2024)