Package level interconnect options. - J. Balachandran; Steven Brebels; Geert Carchon; Tomas Webers; Walter De Raedt; Bart Nauwelaers; Eric Beyne (SLIP, 2005)

Analysis and modeling of power grid transmission lines. - J. Balachandran; Steven Brebels; Geert Carchon; Tomas Webers; Walter De Raedt; Bart Nauwelaers; Eric Beyne (DATE, 2006)

Constant Impedance Scaling Paradigm for Scaling LC transmission lines. - J. Balachandran; Steven Brebels; Geert Carchon; Walter De Raedt; Eric Beyne; Maarten Kuijk; Bart Nauwelaers (ISQED, 2006)

Efficient Link Architecture for On-Chip Serial links and Networks. - J. Balachandran; Maarten Kuijk; Steven Brebels; Geert Carchon; Walter De Raedt; Bart Nauwelaers; Eric Beyne (SoC, 2006)

Constant impedance scaling paradigm for interconnect synthesis. - J. Balachandran; Steven Brebels; Geert Carchon; Maarten Kuijk; Walter De Raedt; Bart Nauwelaers; Eric Beyne (SLIP, 2006)

Wafer-level package interconnect options. - J. Balachandran; Steven Brebels; Geert Carchon; Maarten Kuijk; Walter De Raedt; Bart Nauwelaers; Eric Beyne (IEEE Trans. Very Large Scale Integr. Syst., 2006)