Board level reliability of PBGA using flex substrate. - S. C. Hung; P. J. Zheng; S. H. Ho; S. C. Lee; H. N. Chen; J. D. Wu (Microelectron. Reliab., 2001)

Board level reliability of a stacked CSP subjected to cyclic bending. - J. D. Wu; S. H. Ho; C. Y. Huang; C. C. Liao; P. J. Zheng; S. C. Hung (Microelectron. Reliab., 2002)

Fracture strength characterization and failure analysis of silicon dies. - J. D. Wu; C. Y. Huang; C. C. Liao (Microelectron. Reliab., 2003)

Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. - Po-Jen Zheng; J. Z. Lee; K. H. Liu; J. D. Wu; S. C. Hung (Microelectron. Reliab., 2003)

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. - Kuo-Ming Chen; J. D. Wu; Kuo-Ning Chiang (Microelectron. Reliab., 2006)

A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. - J. D. Wu; P. J. Zheng; C. W. Lee; S. C. Hung; J. J. Lee (Microelectron. Reliab., 2006)