Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias. - P. Zhao; Liesbeth Witters; Anne Jourdain; Michele Stucchi; Nicolas Jourdan 002; J. W. Maes; H. Bana; C. Zhu; R. Chukka; F. Sebaai; Kevin Vandersmissen; N. Heylen; et al. (VLSI Technology and Circuits, 2024)