Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. - Xiaowu Zhang; Ee-Hua Wong; Ranjan Rajoo; Mahadevan K. Iyer; J. F. J. M. Caers; X. J. Zhao (Microelectron. Reliab., 2005)

Correlation studies for component level ball impact shear test and board level drop test. - Ee-Hua Wong; Ranjan Rajoo; S. K. W. Seah; C. S. Selvanayagam; W. D. van Driel; J. F. J. M. Caers; X. J. Zhao; N. Owens; L. C. Tan; M. Leoni; P. L. Eu; Y.-S. Lai; et al. (Microelectron. Reliab., 2008)

Advances in the drop-impact reliability of solder joints for mobile applications. - Ee-Hua Wong; S. K. W. Seah; W. D. van Driel; J. F. J. M. Caers; N. Owens; Y.-S. Lai (Microelectron. Reliab., 2009)