Prediction and verification of process induced warpage of electronic packages. - W. D. van Driel; G. Q. Zhang; J. H. J. Janssen; Leo J. Ernst; Fei Su; Kerm Sin Chian; Sung Yi (Microelectron. Reliab., 2003)

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. - Willem D. van Driel; C. J. Liu; G. Q. Zhang; J. H. J. Janssen; Richard B. R. van Silfhout; Marcel A. J. van Gils; Leo J. Ernst (Microelectron. Reliab., 2004)

Virtual qualification of moisture induced failures of advanced packages. - Marcel A. J. van Gils; W. D. van Driel; G. Q. Zhang; H. J. L. Bressers; Richard B. R. van Silfhout; X. J. Fan; J. H. J. Janssen (Microelectron. Reliab., 2007)

Analysis of Cu/low-k bond pad delamination by using a novel failure index. - Marcel A. J. van Gils; Olaf van der Sluis; G. Q. Zhang; J. H. J. Janssen; R. M. J. Voncken (Microelectron. Reliab., 2007)

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. - Dao-Guo Yang; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang; H. J. L. Bressers; J. H. J. Janssen (Microelectron. Reliab., 2007)

Numerical modeling of warpage induced in QFN array molding process. - Dao-Guo Yang; Kaspar M. B. Jansen; Leo J. Ernst; G. Q. Zhang; W. D. van Driel; H. J. L. Bressers; J. H. J. Janssen (Microelectron. Reliab., 2007)

Thermal heating within SOI. - J. J. Koning; S. Lecaudey; E. Spaan; M. Stoutjesdijk; J. H. J. Janssen (Microelectron. Reliab., 2008)

Thermal-Aware Synthesis of 5G Base Station Antenna Arrays: An Overview and a Sparsity-Based Approach. - Yanki Aslan; Jan Puskely; J. H. J. Janssen; Marcel Geurts; Antoine Roederer; Alexander Yarovoy (IEEE Access, 2018)