RF long term aging behavior and reliability in 22FDX WiFi Power Amplifier designs for 5G applications. - P. Srinivasan 002; J. Lestage; Shafi Syed; X. Hui; Stephen Moss; Oscar D. Restrepo; Oscar H. Gonzalez; Y. Chen; T. McKay; Anirban Bandyopadhyay; Ned Cahoon; Fernando Guarin; et al. (IRPS, 2023)

Thermal Considerations on RF Reliability and Aging in SOI CMOS Based Power Amplifiers. - P. Srinivasan 002; Oscar H. Gonzalez; Oscar D. Restrepo; J. Lestage; Shafi Syed; W. Taylor; Anirban Bandyopadhyay; Martin Gall; S. Ludvik (IRPS, 2024)

A New Methodology to Evaluate Die-Package Level Load-Pull and Ruggedness for RF Long Term Aging for 5G Applications. - P. Srinivasan 002; Oscar H. Gonzalez; J. Lestage; Stephen Moss; Oscar D. Restrepo; S. Ludvik (IRPS, 2025)