Hole-Side Airgap Integration as Enabler for 3D NAND Flash Z-Pitch Scaling. - S. Rachidi; S. Ramesh; Devin Verreck; J. Loyo; Y. Jeong; H. Puliyalil; Jie Li; F. Seidel; Geert Van Den Bosch; Maarten Rosmeulen (IMW, 2025)