Localization of sensitive areas of power AC switch under thermal laser stimulation. - S. Debleds; J. P. Rebrasse; Lionel Dantas de Morais; I. Frapreau; R. Perdreau; B. Morillon (Microelectron. Reliab., 2007)

Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections. - Lionel Dantas de Morais; F. Allanic; F. Roqueta; J. P. Rebrasse (Microelectron. Reliab., 2007)

Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations. - A. Aubert; Lionel Dantas de Morais; J. P. Rebrasse (Microelectron. Reliab., 2008)

Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. - A. Aubert; J. P. Rebrasse; Lionel Dantas de Morais; Nathalie Labat; Hélène Frémont (Microelectron. Reliab., 2010)