Time dependent dielectric breakdown in a low-k interlevel dielectric. - J. R. Lloyd; E. Liniger; S. T. Chen (Microelectron. Reliab., 2004)

Reliability Challenges with Ultra-Low k Interlevel Dielectrics. - J. R. Lloyd; M. R. Lane; X.-H. Liu; E. Liniger; T. M. Shaw; C.-K. Hu; R. Rosenberg (Microelectron. Reliab., 2004)

The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics. - J. R. Lloyd; C. E. Murray; S. Ponoth; S. Cohen; E. Liniger (Microelectron. Reliab., 2006)

Black's law revisited - Nucleation and growth in electromigration failure. - J. R. Lloyd (Microelectron. Reliab., 2007)

Fast diffusers in a thermal gradient (solder ball). - J. R. Lloyd; N. A. Connelly; Xiaoli He; K. J. Ryan; B. H. Wood (Microelectron. Reliab., 2010)

Comparative Study of TDDB Models on BEOL Interconnects for Sub-20 nm Spacings. - Niaz Mahmud; Nabihah Azhari; J. R. Lloyd (IRPS, 2019)

Stress Migration Followed by Electromigration Reliability Testing. - J. M. Passage; Nabihah Azhari; J. R. Lloyd (IRPS, 2019)

A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. - J. Shuster-Passage; S. Abdel Razek; M. Mattoo; Meike Hauschildt; Seungman Choi; Martin Gall; Armen Kteyan; Jun-Ho Choy; Valeriy Sukharev; Matthias Kraatz; J. R. Lloyd (IRPS, 2024)