Rigorous approach for representation and measurement of structural properties of concurrent computer programs. - J. Rose (Inf. Softw. Technol., 1992)

A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing. - G. Williams; Patrick O'Hara; J. Moore; Bart Gordon; J. Rose (3DIC, 2009)

A novel non-invasive radar to monitor honey bee colony health. - A. E. Souza Cunha; J. Rose; J. Prior; Herbert M. Aumann; Nuri W. Emanetoglu; Francis A. Drummond (Comput. Electron. Agric., 2020)