Interference-free tool-path generation in the NC machining of parametric compound surfaces. - J. S. Hwang (Comput. Aided Des., 1992)

Rational approximation to orthogonal bases and of the solutions of elliptic equations. - J. S. Hwang (Numerische Mathematik, 1999)

Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs. - J. S. Hwang (Microelectron. Reliab., 2008)

Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application. - J. S. Hwang; M. J. Yim; K. W. Paik (Microelectron. Reliab., 2008)

Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding. - Wan Ho Song; Michael Mayer; Norman Y. Zhou; S. H. Kim; J. S. Hwang; J. T. Moon (Microelectron. Reliab., 2012)