Measuring stress next to Au ball bond during high temperature aging. - M. Mayer; J. T. Moon; John Persic (Microelectron. Reliab., 2009)

Silver pick up during tail formation in thermosonic wire bonding process. - Jae-sik Lee; Michael Mayer; Norman Y. Zhou; S. J. Hong; J. T. Moon (Microelectron. Reliab., 2011)

Influence of gold pick up on the hardness of copper free air ball. - Jae-sik Lee; Michael Mayer; Norman Y. Zhou; J. T. Moon; John Persic (Microelectron. Reliab., 2011)

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. - A. Pequegnat; H. J. Kim; M. Mayer; Norman Y. Zhou; John Persic; J. T. Moon (Microelectron. Reliab., 2011)

Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. - Aashish Shah; Alireza Rezvani; M. Mayer; Norman Y. Zhou; John Persic; J. T. Moon (Microelectron. Reliab., 2011)

Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding. - Wan Ho Song; Michael Mayer; Norman Y. Zhou; S. H. Kim; J. S. Hwang; J. T. Moon (Microelectron. Reliab., 2012)

Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. - Alireza Rezvani; Aashish Shah; M. Mayer; Norman Y. Zhou; J. T. Moon (Microelectron. Reliab., 2013)