The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. - C. K. Wong; John H. L. Pang; J. W. Tew; B. K. Lok; H. J. Lu; F. L. Ng; Y. F. Sun (Microelectron. Reliab., 2008)