Support Vector Machine Experiments for Road Recognition in High Resolution Images. - J. Y. Lai; Arcot Sowmya; John C. Trinder (MLDM, 2005)

Effects of underfill materials on the reliability of low-K flip-chip packaging. - K. M. Chen; D. S. Jiang; N. H. Kao; J. Y. Lai (Microelectron. Reliab., 2006)

An investigation into the effects of probing and wire bonding stress on the reliability of BOAC. - K. M. Chen; B. C. Wu; K. H. Tang; F. Y. Cheng; N. H. Kao; J. Y. Lai (Microelectron. Reliab., 2006)