Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics. - F. L. Lau; Riko I. Made; Wahyuaji Narottama Putra; J. Z. Lim; V. C. Nachiappan; J. L. Aw; Chee Lip Gan (Microelectron. Reliab., 2013)