Rapid power cycling of flip-chip and CSP components on ceramic substrates. - Jaakko Lenkkeri; Tuomo Jaakola (Microelectron. Reliab., 2001)

Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules. - Risto Rautioaho; Olli Nousiainen; Seppo Leppävuori; Jaakko Lenkkeri; Tuomo Jaakola (Microelectron. Reliab., 2001)

Ltcc Technology For Photonic and Millimeter Wave Module Integration. - Kimmo Keränen; Mikko Karppinen; Jaakko Lenkkeri; Jukka-Tapani Mäkinen; Jyrki Ollila; Pentti Karioja (Int. J. Softw. Eng. Knowl. Eng., 2005)