Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling. - H. V. Nguyen; Cora Salm; J. Vroemen; J. Voets; Benno Krabbenborg; Jaap Bisschop; A. J. Mouthaan; Fred G. Kuper (Microelectron. Reliab., 2002)

Integrated thermo-mechanical design and qualification of wafer backend structures. - G. Q. Zhang; Jaap Bisschop (Microelectron. Reliab., 2004)

Reliability methods and standards. - Jaap Bisschop (Microelectron. Reliab., 2007)

Editorial. - Guido Groeseneken; Ingrid De Wolf; A. J. Mouthaan; Jaap Bisschop (Microelectron. Reliab., 2008)

Determination of the stress level for voltage screen of integrated circuits. - Ramun M. Kho; A. J. Moonen; V. M. Girault; Jaap Bisschop; E. H. T. Olthof; S. Nath; Z. N. Liang (Microelectron. Reliab., 2010)