Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon. - Negin Golshani; Jaber Derakhshandeh; Ryoichi Ishihara; C. I. M. Beenakker; Michael Robertson; Thomas Morrison (3DIC, 2010)

Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics. - Ryoichi Ishihara; Jin Zhang; Miki Trifunovic; Jaber Derakhshandeh; Negin Golshani; Daniel M. R. Tajari Mofrad; Tao Chen; Kees Beenakker; Tatsuya Shimoda (IEICE Trans. Electron., 2014)

Die to wafer 3D stacking for below 10um pitch microbumps. - Jaber Derakhshandeh; Lin Hou; Inge De Preter; Carine Gerets; Samuel Suhard; Vikas Dubey; Geraldine Jamieson; Fumihiro Inoue; Tomas Webers; Pieter Bex; Giovanni Capuz; Eric Beyne; et al. (3DIC, 2016)

Process Complexity and Cost Considerations of Multi-Layer Die Stacks. - Dimitrios Velenis; Joeri De Vos; Soon-Wook Kim; Jaber Derakhshandeh; Pieter Bex; Giovanni Capuz; Samuel Suhard; Kenneth June Rebibis; Stefaan Van Huylenbroeck; Erik Jan Marinissen; Alain Phommahaxay; Andy Miller; et al. (3DIC, 2019)

IP Session on Chiplet: Design, Assembly, and Test. - Bapi Vinnakota; Jaber Derakhshandeh; Eric Beyne; Erik Jan Marinissen; Sreejit Chakravarty (VTS, 2023)