Effect of glue on reliability of flip chip BGA packages under thermal cycling. - Tung T. Nguyen; Donggun Lee; Jae B. Kwak; Seungbae Park (Microelectron. Reliab., 2010)

Dynamic responses of PCB under product-level free drop impact. - Da Yu; Jae B. Kwak; Seungbae Park; John Lee (Microelectron. Reliab., 2010)

WiFi-Based Human Identification with Machine Learning: A Comprehensive Survey. - Manal Mosharaf; Jae B. Kwak; Wooyeol Choi 002 (Sensors, 2024)