7.1 256Gb 3b/cell V-NAND flash memory with 48 stacked WL layers. - Dongku Kang; Woopyo Jeong; Chulbum Kim; Doo-Hyun Kim; Yong-Sung Cho; Kyung-Tae Kang; Jinho Ryu; Kyung-Min Kang; Sungyeon Lee; Wandong Kim; Hanjun Lee; Jaedoeg Yu; et al. (ISSCC, 2016)

256 Gb 3 b/Cell V-nand Flash Memory With 48 Stacked WL Layers. - Dongku Kang; Woopyo Jeong; Chulbum Kim; Doo-Hyun Kim; Yong-Sung Cho; Kyung-Tae Kang; Jinho Ryu; Kyung-Min Kang; Sungyeon Lee; Wandong Kim; Hanjun Lee; Jaedoeg Yu; et al. (IEEE J. Solid State Circuits, 2017)

4.1 A 39GHz-Band CMOS 16-Channel Phased-Array Transceiver IC with a Companion Dual-Stream IF Transceiver IC for 5G NR Base-Station Applications. - Hyun-Chul Park; Daehyun Kang; S. M. Lee; Byungjoon Park; K. Kim; Jooseok Lee; Y. Aoki; Y. Yoon; Seok-Pil Lee; D. Lee; D. Kwon; Seokhyeon Kim; et al. (ISSCC, 2020)

A 512Gb 3b/Cell 7th -Generation 3D-NAND Flash Memory with 184MB/s Write Throughput and 2.0Gb/s Interface. - Jiho Cho; D. Chris Kang; Jongyeol Park; Sangwan Nam; Jung-Ho Song; Bong-Kil Jung; Jaedoeg Lyu; Hogil Lee; Won-Tae Kim 004; Hongsoo Jeon; Sunghoon Kim 001; In-Mo Kim; et al. (ISSCC, 2021)

13.3 A 280-Layer 1Tb 4b/cell 3D-NAND Flash Memory with a 28.5Gb/mm2 Areal Density and a 3.2GB/s High-Speed IO Rate. - Wontaeck Jung; Hyunggon Kim; Do-Bin Kim; Tae-Hyun Kim; Nam-Hee Lee; Dongjin Shin; Minyoung Kim; Youngsik Rho; Hun-Jong Lee; Yujin Hyun; Jaeyoung Park; Taekyung Kim; et al. (ISSCC, 2024)

30.1 A 28Gb/mm24XX-Layer 1Tb 3b/Cell WF-Bonding 3D-NAND Flash with 5.6Gb/s/Pin IOs. - Sang-Soo Park; Jaedoeg Lyu; Myungjun Kim; Jaeyun Lee; Youngsun Song; Chungho Yu; Makoto Hirano; Yongseok Kwon; Jonghoon Park; Hojoon Kim; Daein Lee; Donghyun Seo; et al. (ISSCC, 2025)