Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings. - Young Woo Lee; Ki Ju Lee; Norman Y. Zhou; Jae Pil Jung (Microelectron. Reliab., 2008)

Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking. - Sung Chul Hong; Wang Gu Lee; Won Joong Kim; Jong Hyeong Kim; Jae Pil Jung (Microelectron. Reliab., 2011)

Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps. - Myong-Hoon Roh; Jae Pil Jung; Won Joong Kim (Microelectron. Reliab., 2014)

Application of Surface Protective Coating to Enhance Environment-Withstanding Property of the MEMS 2D Wind Direction and Wind Speed Sensor. - Kyu-Sik Shin; Daesung Lee 001; Sang-Woo Song; Jae Pil Jung (Sensors, 2017)