Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. - Tymon Barwicz; Yoichi Taira; Ted W. Lichoulas; Nicolas Boyer; Hidetoshi Numata; Yves Martin; Jae-Woong Nah; Shotaro Takenobu; Alexander Janta-Polczynski; Eddie L. Kimbrell; Robert Leidy; Marwan Khater; et al. (OFC, 2015)

An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors. - Kevin Tien; Noah Sturcken; Naigang Wang; Jae-Woong Nah; Bing Dang; Eugene J. O'Sullivan; Paul S. Andry; Michele Petracca; Luca P. Carloni; William J. Gallagher; Kenneth L. Shepard (VLSIC, 2015)

High-throughput photonic packaging. - Tymon Barwicz; Ted W. Lichoulas; Yoichi Taira; Yves Martin; Shotaro Takenobu; Alexander Janta-Polczynski; Hidetoshi Numata; Eddie L. Kimbrell; Jae-Woong Nah; Bo Peng; Robert Leidy; Marwan Khater; et al. (OFC, 2017)