Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM. - Taiki Uemura; Byungjin Chung; Jeongmin Jo; Hai Jiang 005; Yongsung Ji; Tae-Young Jeong; Rakesh Ranjan; Seungbae Lee; Hwasung Rhee; Sangwoo Pae; Euncheol Lee; Jaehee Choi; et al. (IRPS, 2020)

Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET. - Taiki Uemura; Byungjin Chung; Jeongmin Jo; Hai Jiang 005; Yongsung Ji; Tae-Young Jeong; Rakesh Ranjan; Youngin Park; Kiil Hong; Seungbae Lee; Hwasung Rhee; Sangwoo Pae; et al. (IRPS, 2020)

Soft-Error Susceptibility in Flip-Flop in EUV 7 nm Bulk-FinFET Technology. - Taiki Uemura; Byungjin Chung; Jeongmin Jo; Mijoung Kim; Dalhee Lee; Gunrae Kim; Seungbae Lee; Taesjoong Song; Hwasung Rhee; Brandon Lee; Jaehee Choi (IRPS, 2021)

Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology. - Taiki Uemura; Byungjin Chung; Jegon Kim; Hyewon Shim; Shin-Young Chung; Brandon Lee; Jaehee Choi; Shota Ohnishi; Ken Machida (IRPS, 2022)

Accelerator-Based Thermal-Neutron Beam by Compact and Low-Cost Moderator for Soft-Error Evaluation in Semiconductor Devices. - Taiki Uemura; Byungjin Chung; Jegon Kim; Hyewon Shim; Shin-Young Chung; Brandon Lee; Jaehee Choi; Shota Ohnishi; Ken Machida (IRPS, 2022)

Soft-Error Sensitivity in SRAM Manufactured by Bulk Gate-All-Around (GAA) Technology. - Taiki Uemura; Byungjin Chung; Jaehee Choi; Seungbae Lee; Shin-Young Chung; Yuchul Hwang; Sangwoo Pae (IRPS, 2024)

Comprehensive Study of SER in FDSOI-Planar: 28 nm to 18 nm Scaling Effect and Temperature Dependence. - Taiki Uemura; Byungjin Chung; Jaehee Choi; Seungbae Lee; Shin-Young Chung; Yuchul Hwang; Sangwoo Pae (IRPS, 2024)