Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip. - Haoran Wen; Anosh Daruwalla; Yaesuk Jeong; Pranav Gupta; Jaehoo Choi; Chang-Shun Liu; Farrokh Ayazi (PLANS, 2018)