Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. - Sumin Choi; Heegon Kim; Daniel H. Jung; Jonghoon J. Kim; Jaemin Lim; Hyunsuk Lee; Kyungjun Cho; Joungho Kim; Hyungsoo Kim; Yong-Ju Kim; Yunsaing Kim (3DIC, 2015)

Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. - Hyunsuk Lee; Kyungjun Cho; Heegon Kim; Sumin Choi; Jaemin Lim; Joungho Kim (3DIC, 2015)

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. - Jonghoon J. Kim; Daniel H. Jung; Heegon Kim; Sunkyu Kong; Sumin Choi; Jaemin Lim; Joungho Kim (EMC Compo, 2015)

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. - Jaemin Lim; Manho Lee; Daniel H. Jung; Jonghoon J. Kim; Sumin Choi; Hyunsuk Lee; Joungho Kim (EMC Compo, 2015)

ViewMap: Sharing Private In-Vehicle Dashcam Videos. - Minho Kim; Jaemin Lim; Hyunwoo Yu; Kiyeon Kim; Younghoon Kim; Suk-Bok Lee (NSDI, 2017)

Preserving Location Privacy of Connected Vehicles With Highly Accurate Location Updates. - Jaemin Lim; Hyunwoo Yu; Kiyeon Kim; Minho Kim; Suk-Bok Lee (IEEE Commun. Lett., 2017)

Pinto: Enabling Video Privacy for Commodity IoT Cameras. - Hyunwoo Yu; Jaemin Lim; Kiyeon Kim; Suk-Bok Lee (CCS, 2018)

Making Connected Cars Untraceable via DSRC Radios. - Jaemin Lim; Kiyeon Kim; Hyunwoo Yu; Suk-Bok Lee (IEEE Access, 2020)

Overo: Sharing Private Audio Recordings. - Jaemin Lim; Kiyeon Kim; Hyunwoo Yu; Suk-Bok Lee (CCS, 2022)

Wav2vec-VC: Voice Conversion via Hidden Representations of Wav2vec 2.0. - Jaemin Lim; Kiyeon Kim (ICASSP, 2024)