8Gb 3D DDR3 DRAM using through-silicon-via technology. - Uksong Kang; Hoeju Chung; Seongmoo Heo; Soon-Hong Ahn; Hoon Lee; Sooho Cha; Jaesung Ahn; Dukmin Kwon; Jin Ho Kim; Jae-Wook Lee 007; Han-Sung Joo; Woo-Seop Kim; et al. (ISSCC, 2009)

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology. - Uksong Kang; Hoeju Chung; Seongmoo Heo; Dukha Park; Hoon Lee; Jin Ho Kim; Soon-Hong Ahn; Sooho Cha; Jaesung Ahn; Dukmin Kwon; Jae-Wook Lee 007; Han-Sung Joo; et al. (IEEE J. Solid State Circuits, 2010)

Rethinking Efficacy of Softmax for Lightweight Non-local Neural Networks. - Yooshin Cho; Youngsoo Kim; Hanbyel Cho; Jaesung Ahn; Hyeong Gwon Hong; Junmo Kim 002 (ICIP, 2022)

Implicit 3D Human Mesh Recovery using Consistency with Pose and Shape from Unseen-view. - Hanbyel Cho; Yooshin Cho; Jaesung Ahn; Junmo Kim 002 (CVPR, 2023)

Video Inference for Human Mesh Recovery with Vision Transformer. - Hanbyel Cho; Jaesung Ahn; Yooshin Cho; Junmo Kim 002 (FG, 2023)

Localization using Multi-Focal Spatial Attention for Masked Face Recognition. - Yooshin Cho; Hanbyel Cho; Hyeong Gwon Hong; Jaesung Ahn; Dongmin Cho; JungWoo Chang; Junmo Kim 002 (FG, 2023)

Foreseeing Reconstruction Quality of Gradient Inversion: An Optimization Perspective. - Hyeong Gwon Hong; Yooshin Cho; Hanbyel Cho; Jaesung Ahn; Junmo Kim 002 (AAAI, 2024)

Controllable Feature Whitening for Hyperparameter-Free Bias Mitigation. - Yooshin Cho; Hanbyel Cho; Janghyeon Lee; Hyeong Gwon Hong; Jaesung Ahn; Junmo Kim (CoRR, 2025)