Future on-chip interconnect metallization and electromigration. - Chao-Kun Hu; James J. Kelly; Huai Huang; Koichi Motoyama; Hosadurga Shobha; Yuri Ostrovski; James H.-C. Chen; Raghuveer Patlolla; Brown Peethala; Praneet Adusumilli; Terry A. Spooner; Roger Quon; et al. (IRPS, 2018)

Time Dependent Dielectric Breakdown of Cobalt and Ruthenium Interconnects at 36nm Pitch. - H. Huang; P. S. McLaughin; James J. Kelly; C.-C. Yang; Richard G. Southwick; M. Wang; Griselda Bonilla; Gauri Karve (IRPS, 2019)