Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability. - Wei Huang; James M. Loman; Bülent Sener (Microelectron. Reliab., 2002)

A reliability model of a warm standby configuration with two identical sets of units. - Wei Huang; James M. Loman; Thomas Song (Reliab. Eng. Syst. Saf., 2015)