Effect of voids on the reliability of BGA/CSP solder joints. - Mohammad Yunus; K. Srihari; James M. Pitarresi; Anthony Primavera (Microelectron. Reliab., 2003)

Analytical model for the transient analysis of electronic assemblies subjected to impact loading. - Mohammad A. Gharaibeh; Quang T. Su; James M. Pitarresi (Microelectron. Reliab., 2018)