Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors. - James N. Humenik; James M. Oberschmidt; Leon L. Wu; Scott G. Paull (IBM J. Res. Dev., 1992)

High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. - Rao R. Tummala; John U. Knickerbocker; Sarah H. Knickerbocker; L. Wynn Herron; Robert W. Nufer; Raj N. Master; Mark O. Neisser; Benedikt M. Kellner; Charles H. Perry; James N. Humenik; Thomas F. Redmond (IBM J. Res. Dev., 1992)

An advanced multichip module (MCM) for high-performance UNIX servers. - John U. Knickerbocker; Frank L. Pompeo; Alice F. Tai; Donald L. Thomas; Roger D. Weekly; Michael G. Nealon; Harvey C. Hamel; Anand Haridass; James N. Humenik; Richard A. Shelleman; Srinivasa N. Reddy; Kevin M. Prettyman; et al. (IBM J. Res. Dev., 2002)