Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology. - F. Griggio; James Palmer 002; F. Pan; N. Toledo; Anthony Schmitz; Ilan Tsameret; R. Kasim; Gerald S. Leatherman; Jeffery Hicks; A. Madhavan; J. Shin; J. Steigerwald; et al. (IRPS, 2018)

A Reliability Overview of Intel's 10+ Logic Technology. - Rohit Grover; Tony Acosta; C. AnDyke; Emre Armagan; C. Auth; Sunny Chugh; K. Downes; M. Hattendorf; N. Jack; S. Joshi; R. Kasim; Gerald S. Leatherman; et al. (IRPS, 2020)

Reliability Characterization for 12 V Application Using the 22FFL FinFET Technology. - Chen-Yi Su; Mark Armstrong; Sunny Chugh; Mohammed El-tanani; Hannes Greve; Hai Li 008; Mahjabin Maksud; Benjamin Orr; Christopher Perini; James Palmer 002; Leif Paulson; Stephen Ramey; et al. (IRPS, 2020)

Intrinsic Reliability of BEOL interlayer dielectric. - James Palmer 002; Galor Zhang; Justin R. Weber; Cheyun Lin; Christopher Perini; Rahim Kasim (IRPS, 2021)

Customized Parallel Reliability Testing Platform with Multifold Throughput Enhancement for Intel Stressing Tests. - Peng Xiao; Haris Hadziosmanovic; Michael Klessens; Rong Jiang; John Ortega 002; Daniel Schroeder; James Palmer 002; Ilan Tsameret (IRPS, 2021)

Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes. - Rahim Kasim; Cheyun Lin; Christopher Perini; James Palmer 002; N. Gilda; S. Imam; Justin R. Weber; C. Wallace; Jeffery Hicks (IRPS, 2023)