Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures. - James W. Joyner; Payman Zarkesh-Ha; Jeffrey A. Davis; James D. Meindl (SLIP, 2000)

Impact of three-dimensional architectures on interconnects in gigascale integration. - James W. Joyner; Raguraman Venkatesan; Payman Zarkesh-Ha; Jeffrey A. Davis; James D. Meindl (IEEE Trans. Very Large Scale Integr. Syst., 2001)

Global interconnect design in a three-dimensional system-on-a-chip. - James W. Joyner; Payman Zarkesh-Ha; James D. Meindl (IEEE Trans. Very Large Scale Integr. Syst., 2004)