The evolution of build-up package technology and its design challenges. - Edmund D. Blackshear; Moises Cases; Erich Klink; Stephen R. Engle; Ronald S. Malfatt; Daniel N. deAraujo; Stefano Oggioni; Luke D. Lacroix; Jamil A. Wakil; Nam H. Pham; Gareth G. Hougham; David J. Russell (IBM J. Res. Dev., 2005)

Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks. - Jamil A. Wakil (Microelectron. Reliab., 2006)

Temperature-limited microprocessors: Measurements and design implications. - Hendrik F. Hamann; Alan J. Weger; James A. Lacey; Zhigang Hu; Pradip Bose; Erwin B. Cohen; Jamil A. Wakil (VLSI Design, 2007)

Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements. - Hendrik F. Hamann; Alan J. Weger; James A. Lacey; Zhigang Hu; Pradip Bose; Erwin B. Cohen; Jamil A. Wakil (IEEE J. Solid State Circuits, 2007)

Spatial and temporal thermal characterization of stacked multicore architectures. - Eren Kursun; Jamil A. Wakil; Mukta Farooq; Robert Hannon (ACM J. Emerg. Technol. Comput. Syst., 2012)