Conductive adhesives for through holes and blind vias metallization. - Ryszard Kisiel; Janusz Borecki; Grazyna Koziol; Jan Felba (Microelectron. Reliab., 2005)

Polytronic 2005. - Andrzej Dziedzic; Jan Felba (Microelectron. Reliab., 2007)

Problems of PCB microvias filling by conductive paste. - Ryszard Kisiel; Jan Felba; Janusz Borecki; Andrzej Moscicki (Microelectron. Reliab., 2007)