TSV metrology and inspection challenges. - Ramakanth Alapati; Youssef Travaly; Jan Van Olmen; Ricardo Cotrin Teixeira; Jan Vaes; Marc van Cauwenbergh; Anne Jourdain; Greet Verbinnen; Gino Marcuccilli; Glenn Florence; Shay Wolfling; Christine Pelissier; et al. (3DIC, 2009)

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). - Jan Van Olmen; Jan Coenen; Wim Dehaene; Kristin De Meyer; Cedric Huyghebaert; Anne Jourdain; Guruprasad Katti; Abdelkarim Mercha; Michal Rakowski; Michele Stucchi; Youssef Travaly; Eric Beyne; et al. (3DIC, 2009)

Design issues and considerations for low-cost 3D TSV IC technology. - Geert Van der Plas; Paresh Limaye; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Domae Shinichi; Vladimir Cherman; et al. (ISSCC, 2010)

Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures. - Y. Yang; Riet Labie; F. Ling; C. Zhao; A. Radisic; Jan Van Olmen; Youssef Travaly; Bert Verlinden; Ingrid De Wolf (Microelectron. Reliab., 2010)

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. - Geert Van der Plas; Paresh Limaye; Igor Loi; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Vladimir Cherman; et al. (IEEE J. Solid State Circuits, 2011)

Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors. - Pawel E. Malinowski; Epimitheas Georgitzikis; Jorick Maes; Ioanna Vamvaka; Fortunato Frazzica; Jan Van Olmen; Piet De Moor; Paul Heremans; Zeger Hens; David Cheyns (Sensors, 2017)