Numerical approach to characterization of thermally conductive adhesives. - Tomasz Falat; Artur Wymyslowski; Jana Kolbe (Microelectron. Reliab., 2007)

Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. - Tomasz Falat; Artur Wymyslowski; Jana Kolbe; Kaspar M. B. Jansen; Leo J. Ernst (Microelectron. Reliab., 2007)

Inkjettable conductive adhesive for use in microelectronics and microsystems technology. - Jana Kolbe; Andreas Arp; Francesco Calderone; Edouard Marc Meyer; Wilhelm Meyer; Helmut Schaefer; Manuela Stuve (Microelectron. Reliab., 2007)