Effects of bonding force on contact pressure and frictional energy in wire bonding. - Yong Ding; Jang-Kyo Kim; Pin Tong (Microelectron. Reliab., 2006)

Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise. - Yong Ding; Jang-Kyo Kim (Microelectron. Reliab., 2008)