Research on the high-speed pick and place device for die bonders. - Hsing-Hsin Huang; Jay Wey (ICCA, 2010)

LPWAN Technologies: Design and Implementation of WEIGHTLESS Enabled AMI in Tai-Power. - Fabien Petitgrand; Tien-Haw Peng; Jay Wey; Siraj Sabihuddin; V. S. K. Murthy Balijepalli (ISGT, 2021)