A Distributed Autonomous and Collaborative Multi-Robot System Featuring a Low-Power Robot SoC in 22nm CMOS for Integrated Battery-Powered Minibots. - Vinayak Honkote; Dileep Kurian; Sriram Muthukumar; Dibyendu Ghosh; Satish Yada; Kartik Jain; Bradley Jackson; Ilya Klotchkov; Mallikarjuna Rao Nimmagadda; Shreela Dattawadkar; Pranjali Deshmukh; Ankit Gupta 011; et al. (ISSCC, 2019)

Self-Powered IOT System for Edge Inference. - Dileep Kurian; Tanay Karnik; Saksham Soni; Saransh Chhabra; Suhwan Kim 002; Jaykant Timbadiya; Ankit Gupta 011; Krishnan Ravichandran; Mukesh Bhartiya; Angela Nicoara (ISQED, 2020)

A Fully Integrated Cryo-CMOS SoC for Qubit Control in Quantum Computers Capable of State Manipulation, Readout and High-Speed Gate Pulsing of Spin Qubits in Intel 22nm FFL FinFET Technology. - Jong Seok Park 001; Sushil Subramanian; Lester Lampert; Todor Mladenov; Ilya Klotchkov; Dileep Kurian; Esdras Juárez-Hernández; Brando Perez Esparza; Sirisha Rani Kale; K. T. Asma Beevi; Shavindra P. Premaratne; Thomas Watson 006; et al. (ISSCC, 2021)

A Fully Integrated Cryo-CMOS SoC for State Manipulation, Readout, and High-Speed Gate Pulsing of Spin Qubits. - Jongseok Park 001; Sushil Subramanian; Lester Lampert; Todor Mladenov; Ilya Klotchkov; Dileep Kurian; Esdras Juarez Hernandez; Brando Perez Esparza; Sirisha Rani Kale; K. T. Asma Beevi; Shavindra P. Premaratne; Thomas Watson 006; et al. (IEEE J. Solid State Circuits, 2021)

A 6.0mW 3.8GS/s 7b VTC/TDC-Assisted Interleaved SAR ADC with 13GHz ERBW. - Amy Whitcombe; Chun C. Lee; Asma Kuriparambil Thekkumpate; Somnath Kundu; Jaykant Timbadiya; Abhishek Agrawal; Brent R. Carlton; Peter Sagazio; Stefano Pellerano; Christopher D. Hull (VLSI Technology and Circuits, 2022)

A VTC/TDC-Assisted 4× Interleaved 3.8 GS/s 7b 6.0 mW SAR ADC With 13 GHz ERBW. - Amy Whitcombe; Chun C. Lee; Asma Kuriparambil Thekkumpate; Somnath Kundu; Jaykant Timbadiya; Abhishek Agrawal; Brent R. Carlton; Peter Sagazio; Stefano Pellerano; Christopher D. Hull (IEEE J. Solid State Circuits, 2023)

System-Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution. - Srivatsa Rangachar Srinivasa; Dileep Kurian; Paolo A. Aseron; Prerna Budhkar; Vinayak Honkote; Dan Lake; Jaykant Timbadiya; Satish Yada; Suresh Kadavakollu; James Greensky; Gauthaman Murali; Anuradha Srinivasan; et al. (ACM Great Lakes Symposium on VLSI, 2025)

A 300MB SRAM, 20Tb/s Bandwidth Scalable Heterogenous 2.5D System Inferencing Simultaneous Streams Across 20 Chiplets with Workload-Dependent Configurations. - Srivatsa Rangachar Srinivasa; Dileep Kurian; Paolo A. Aseron; Prerna Budhkar; Arun Radhakrishnan; Alejandro Cardenas Lopez; Jainaveen Sundaram; Vinayak Honkote; Leonid Azarenkov; Dan Lake; Jaykant Timbadiya; Mikhail J. Moiseev; et al. (ISSCC, 2025)