Any-Angle Routing for Redistribution Layers in 2.5D IC Packages. - Min-Hsuan Chung; Je-Wei Chuang; Yao-Wen Chang (DAC, 2023)

Redistribution Layer Routing with Dynamic Via Insertion Under Irregular Via Structures. - Je-Wei Chuang; Zong-Han Wu; Bo-Ying Huang; Yao-Wen Chang (DAC, 2024)